Call for Abstracts Deadline: February 5, 2026
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Abstract Submission

Abstract Deadline: February 5, 2026

Abstract Submission Guidelines

Please review the steps below before entering the online abstract submission site.

Awards: Both ALD and ALE will recognize student achievement with awards
for the best student posters and/or talks. See Awards Page

  • Step 1

    Before signing up or logging into the online system (in Step 5), please review all of the following steps to ensure you have the information needed to complete the abstract submission process.

    Please Note the Following Requirements Prior to Submission:

    1. If you are planning to submit multiple abstracts, presenters are limited to one oral and one poster presentation. One submission must be to an oral session and one to a poster session. Must be two DIFFERENT abstracts – not the same abstract submitted as both an oral and a poster
    2. All ALD/ALE oral presentations, including the question and answer period and any discussions, will be audio recorded and synchronized with your PowerPoint presentation file and compiled into conference proceedings accessible to all attendees after the meeting. The conference proceedings will also include PDF files of the poster presentations. Participation in the conference proceedings is mandatory.
    3. You will need to agree to the copyright agreement
  • Step 2

    You will be asked to select your topic. The list will be similar to the main topics listed below.

  • Step 3

    Fill out the abstract content and author details in the system (abstract 2,700 characters max. including grammar and spacing; you may also submit a supplemental 1 page PDF file containing any graphs, charts or pictures you wish to include)

  • Step 4

    Accept the copyright agreement. If you have questions e-mail della@avs.org.

STEP 5

Opens: November 15, 2024
Due: February 5, 2025

SUBMIT ABSTRACT

Author Notification

Acknowledgment that your abstract has been submitted will follow by e-mail shortly after submission. Notifications regarding acceptances will be sent by e-mail by March 16, 2026.

Tentative Topics

ALD Applications
ALD Fundamentals: Growth and Characterization
ALD For Manufacturing
Area Selective Atomic Layer Deposition
Emerging Materials
Atomic Layer Etching Workshop
ALD Applications
  • AA1: Energy Conversion: Catalysis, Fuel Cells and Solar Energy
  • A2: Batteries and Energy Storage
  • AA3: ULSI FEOL/BEOL Materials and Devices: High- and Low-k, Contact Metals, Ultrathin Interconnects and Diffusion Barriers
  • AA4: Memory Applications: DRAM, RRAM, Flash, Neuromorphic, and More
  • AA5: More than Moore Applications: Advanced Sensors, RF Devices, Heterogeneous Integration
  • AA6: 3D Semiconductor Devices
  • AA7: Optoelectronics and Photonics
  • AA8: Biological and Pharmaceutical Applications and Coatings
  • AA9: Novel ALD Applications
  • AA10: ALD Applications Poster Session
ALD Fundamentals: Growth and Characterization
  • AF1: Precursor Design and Development
  • AF2: Process Modeling: AI/ML/Ab Initio Modeling of Reaction Mechanisms and Precursors
  • AF3: Advancements in Metrology: In-situ and Ex-situ Characterization of ALD Films
  • AF4: Plasma Enhanced ALD
  • AF5: Powder and Extreme Surface Area ALD
  • AF6: Low Temperature ALD: Precursors, Process Development, and Equipment
  • AF7: Other Advanced Growth Processes: Epitaxy, Co-dosing, Etc.
  • AF8: ALD Fundamentals Poster Session
ALD For Manufacturing
  • AM1: Large Scale Equipment Design, Process Control, and Precursor Delivery
  • AM2: Spatial and Fast ALD
  • AM3: Process Analysis and Control: Metrology, AI/ML for Manufacturing and Digital Twins
  • AM4: ALD for Manufacturing Poster Session
Area Selective Atomic Layer Deposition
  • AS1: Selective ALD by Area-Activation
  • AS2: Selective ALD by Area-Deactivation
  • AS3: Inherently Selective Processes
  • AS4: Area Selective ALD Poster Session
Emerging Materials
  • EM1: Molecular Layer Deposition and Hybrid Materials
  • EM2: Vapor Phase Infiltration
  • EM3: Metal-Organic Frameworks (MOFs)
  • EM4: Atomic Layer Annealing
  • EM5: Next generation semiconductor materials: AlScN, GaN, BTO, Ga2O3, Novel Metals, Etc.
  • EM6: Nanoscale Materials: 2D, Nanoparticles, Nanotubes, and Nanowires
  • EM7: Advances in Supercycle Processes for Complex Materials: Doping, Ternary/Quaternary Materials, Nanolaminates, Etc.
  • EM8: Energy Enhanced ALD: Beyond Plasma Processes
  • EM9: Emerging Materials and Processes Poster Session
Atomic Layer Etching Workshop
  • ALE1: Plasma and/or Energy-Enhanced ALE
  • ALE2: Gas-phase and/or Thermal ALE
  • ALE3: Solution-based Including Wet ALE
  • ALE4: Materials Selective ALE, Including Area-Selective (Without Masks)
  • ALE5: ALE Hardware & Instrumentation
  • ALE6: Modeling of ALE
  • ALE7: Atomic Layer Cleaning (ALC) + Surface Passivation
  • ALE8: Integration of ALD + ALE, Also with Other Processing Methods (Novel Equipment, Processes, and Materials)
  • ALE9: Applications for ALE (e.g. Compound Semiconductors, Low Damage Processing, throughput improvement)
  • ALE10: Alternative Methods to Achieve ALE or Quasi-ALE (Beam Activation, Gas/Power/Bias Pulsing, etc.)
  • ALE11: Metrology & Diagnostics in ALE
  • ALE12: Emerging Topics in ALE
  • ALE13: Process Data Analytics, Machine Learning, and AI for ALD and ALE Manufacturing
  • ALE14: Sustainability
  • ALE15: Atomic Layer Etching Poster Session

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Key Dates

Abstract Submission Deadline:
February 5, 2026

Author Acceptance Notifications:
March 16, 2026

Early Registration Deadline:
May 1, 2026

Hotel Reservation Deadline:
May 1, 2026

Manuscript Deadline:
Novmeber 1, 2026

Downloads

  • Code of Conduct (PDF)
  • Copyright Agreement (PDF)
  • Presentation Guidelines
  • Sponsor & Exhibit Form (PDF)

Contact

AVS
Della Miller

Event Manager
110 Yellowstone Dr. Suite 120
Chico, CA 95973
(530) 896-0477
della@avs.org

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